Sunday, April 7th 2013, 1:20am
This post has been edited 4 times, last edit by "eysteinh" (Apr 7th 2013, 10:21am)
Sunday, April 7th 2013, 7:18am
Sunday, April 7th 2013, 8:27am
Phosphorus emitter is made on boron doped wafer. This equipment makes p-type based cells.which not only offers outstanding phosphorus diffusion capabilities, but also enables the reliable implementation of higher resistance emitters on a low-cost basis"
Sunday, April 7th 2013, 9:54am
This post has been edited 4 times, last edit by "eysteinh" (Apr 7th 2013, 10:08am)
Sunday, April 7th 2013, 10:03am
Sunday, April 7th 2013, 10:20am
Sunday, April 7th 2013, 11:11am
According to my understanding REC is NOT moving to n-type wafers but has purchased equipment for selective emitter technology on p-type wafers.
Sunday, April 7th 2013, 12:14pm
P-type wafer is made by doping polysilicon with boron. This wafer then is diffused with layer of phosphorus. This junction is called p-n juncitonThats correct, I read an article with the different terminology but I have cheched with two other articles now and indeed its usually boron based silicon that is doped with phosphorus.
The n wafer is the opposite, phosphorus based silicon doped with boron.
Sunday, April 7th 2013, 2:01pm
P-type wafer is made by doping polysilicon with boron. This wafer then is diffused with layer of phosphorus. This junction is called p-n junciton
N-type wafer is doped with phosphorus, and has boron diffused onto it. This junction is called n-p junction.
REC is going to use it for its phosphorus diffusion, nothing of n-type.
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